Lee Yong-Seok

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Prof. 이용석

이용석 교수 연구실(S-CARELAB, 구조 전산해석 및 신뢰성 평가 연구실)은 건국대 기계공학과 소속으로, 반도체 패키징과 실험역학을 연구한다. 금속 박막·연성 소재의 기계적 거동과 피로, 마이크로일렉트로닉스 패키징의 신뢰성 평가를 다룬다.

반도체 패키징 및 실험역학

Crack Diagnosis of Surface-Mount Capacitors Using AI Classification Models with Multi-Parameter Impedance SpectraElectronics · 2025
Effect on Temperature Uniformity by Factor for the Design of Heater Pattern of Electrostatic ChuckJournal of the Microelectronics and Packaging Society · 2024
Stress Analysis for Silicon Die Pick-up Process Through Finite Element AnalysisTransactions of the Korean Society of Mechanical Engineers A · 2023
High-Speed Multilevel Binary Imaging CMOS Image Sensor for Object Feature ExtractionIEEE Sensors Journal · 2022