Kiho Choi
Kiho Choi
Kyung Hee University · Electrical and Electronic Engineering
Professor
Prof. 최기호
Professor's page · publicationsAbout
최기호 교수 연구실(VCP-Lab, Video Coding and Processing Lab)은 경희대 전자공학과 소속으로, 국제표준(VVC/MPEG) 기반 영상·이미지 압축 기술을 연구한다. 차세대 비디오 코딩, 딥러닝 기반 이미지 압축, 4K/8K 및 VR/AR 응용을 다룬다.
Research keywords
Selected publications
- Swin–YOLOv12: A Hybrid Transformer-Based Deep Learning Approach for Enhanced Real-Time Brain Tumor Detection in MRI ImagesMathematics · 2026
- GHMSA-Net: Gated Hierarchical Multi-Scale Self-Attention for Perceptually-Guided AV1 Post-ProcessingIEEE Access · 2025
- DRGNet: Enhanced VVC Reconstructed Frames Using Dual-Path Residual Gating for High-Resolution VideoSensors · 2025
- Multi-Scale Self-Attention-Based Convolutional-Neural-Network Post-Filtering for AV1 CodecMathematics · 2025
- DREFNet: Deep Residual Enhanced Feature GAN for VVC Compressed Video Quality ImprovementMathematics · 2025
- YOLO11-Driven Deep Learning Approach for Enhanced Detection and Visualization of Wrist Fractures in X-Ray ImagesMathematics · 2025
Other labs in this department
- Haneul KoRecruiting
Ko Haneul
5G/6G mobile core network, network automation, mobile edge computing, softwarized networking, electric vehicular networks, mobility management
- Suwan KimRecruiting
Kim Suwan
AI-aided design automation (EDA): machine-learning-driven standard-cell synthesis, physical design, and circuit optimization for advanced semiconductor technologies
- Jeong Hoan ParkRecruiting
Park Jeong Hoan
Low-power compact system design beyond ICs: neuromorphic neural interface SoCs, self-powered IoT sensing nodes, chip-to-chip interfaces and design-for-test for 3D ICs
- Junyong ParkRecruiting
Park Junyong
Signal and power integrity (SI/PI) for advanced package design
- Hyundong ShinRecruiting
Shin Hyundong
Wireless communication, machine intelligence, and quantum information science
- Seunghyun LeeRecruiting
Lee Seunghyun
Nanoelectronic devices and circuits (neuromorphic/brain-inspired computing, resistive memory/ReRAM, processing-in-memory, 2D materials, 3D integration)