Haejoon Jung
Haejoon Jung
Kyung Hee University · Electrical and Electronic Engineering
Professor
Prof. 정해준
Professor's page · publicationsAbout
정해준 교수 연구실(Wireless Systems Lab)은 경희대 전자공학과 소속으로, 차세대 무선통신(5G/6G) 통신이론과 시스템 구현을 연구한다. NOMA, 협력 빔포밍, 저궤도 위성·드론 기반 비지상 네트워크, 무선전력전송, 물리계층 보안을 다룬다.
Research keywords
Selected publications
- Intent-Driven Hierarchical DRL for Secrecy-Aware AoI–AoLI Optimization in RIS-Assisted HAP-IoT CommunicationsIEEE Internet of Things Journal · 2026
- Performance Enhancement for CNN-based Classification of Low Probability of Intercept Radar SignalsIEEE Transactions on Vehicular Technology · 2026
- Quantum Deep Reinforcement Learning for URLLC Satellite-Air-Ground Integrated NetworksIEEE Internet of Things Journal · 2025
- Towards the Internet of Medical Things for Real-Time Health Monitoring over Wi-FiIEEE Network · 2024
- Novel Resource Allocation Algorithm for IoT Networks With Multi-Carrier NOMAIEEE Internet of Things Journal · 2024
- On Minimizing the Age of Information in NOMA-Based Vehicular NetworksIEEE Transactions on Intelligent Transportation Systems · 2023
Other labs in this department
- Haneul KoRecruiting
Ko Haneul
5G/6G mobile core network, network automation, mobile edge computing, softwarized networking, electric vehicular networks, mobility management
- Suwan KimRecruiting
Kim Suwan
AI-aided design automation (EDA): machine-learning-driven standard-cell synthesis, physical design, and circuit optimization for advanced semiconductor technologies
- Jeong Hoan ParkRecruiting
Park Jeong Hoan
Low-power compact system design beyond ICs: neuromorphic neural interface SoCs, self-powered IoT sensing nodes, chip-to-chip interfaces and design-for-test for 3D ICs
- Junyong ParkRecruiting
Park Junyong
Signal and power integrity (SI/PI) for advanced package design
- Hyundong ShinRecruiting
Shin Hyundong
Wireless communication, machine intelligence, and quantum information science
- Seunghyun LeeRecruiting
Lee Seunghyun
Nanoelectronic devices and circuits (neuromorphic/brain-inspired computing, resistive memory/ReRAM, processing-in-memory, 2D materials, 3D integration)