Terahertz Interconnection and Package Lab

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Professor

Prof. 김정호

About

KAIST 전기및전자공학부 김정호(Joungho Kim) 교수의 TERALAB(Terabyte Interconnection and Package Laboratory)이다. 차세대 반도체 패키지, 고대역폭 메모리(HBM), 2.5D/3D 집적회로, AI 기반 설계 자동화를 연구한다. 시그널 인테그리티(SI)·파워 인테그리티(PI)·써멀 인테그리티(TI)·EMI/EMC 문제를 분석하고 혁신적 설계·최적화 방법론을 개발한다.

Research keywords

Signal integrityEMI/EMCinterconnectionSiP/PCB design

Selected publications

Signal/Power Integrity Aware Design and Computing Performance Analysis of SRAM-Bridge Embedded-GPU-HBM ArchitectureIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems · 2026
3D NMC-HBM: Design of 3D Near Memory Computing Architecture in High Bandwidth Memory considering Signal/Power Integrity and Computing PerformanceIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems · 2026
PDNFormer: Fast, Accurate and Scalable Impedance Estimator for Grid-Type Multi-Layered Power Distribution Networks with Multi-Power DomainsIEEE Transactions on Components, Packaging and Manufacturing Technology · 2026
Generative Adversarial Learning Based Power Noise Induced Eye Diagram Estimation Method for High-Speed Channel DesignIEEE Transactions on Electromagnetic Compatibility · 2025
Advanced Chiplet Placement and Routing Optimization considering Signal IntegrityIEEE Transactions on Components, Packaging and Manufacturing Technology · 2025
Pin-Opt: Graph Representation Learning for Large-Scale Pin Assignment OptimizationIEEE Transactions on Components, Packaging and Manufacturing Technology · 2024

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