Thermal Science Laboratory for Semiconductor Packaging & Integration
University of California, Los Angeles · Mechanical and Aerospace Engineering
Graduate application deadlines
Mechanical and Aerospace Engineering
PhD in Mechanical Engineering / Aerospace Engineering
Fall 2027Application deadline
Dec 1, 2026 23:59 PST
Source: mae.ucla.eduChecked Nov 2, 2026MS in Mechanical Engineering / Aerospace Engineering
Fall 2027Application deadline
Dec 1, 2026 23:59 PST
Source: mae.ucla.eduChecked Nov 2, 2026
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Prof. Tiwei Wei at University of California, Los Angeles Mechanical and Aerospace Engineering lists Heat Transfer in Advanced Semiconductor Interconnects & Packaging, Electronic Cooling & Efficient Thermal Packaging Materials, Thermal/Mechanical Simulation & Characterization, Materials, Processing & Architecture Development for Semiconductor Packaging as their registered research area.
Research keywords
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